Инструкция Lg B1300

LG B1. 30. 0 SERVICE MANUAL Pdf Download. B1. 30. 0 SERVICE MANUAL SERVICE MANUAL.. Table of Contents …………………… Chapter 1 - Performance 1- 1. Performance …………………………………………. HW Feature …………………………………………… …………………… Chapter 2 – Technical Brief 2- 1.

Следуйте отдельным инструкциям по извлечению аккумулятора. Установите SIM-карту в гнездо так, чтобы позолоченные контакты были обращены вниз.. Service Manual LG 600, 3,22 MБ, 08-02-2007 10:59, 370. Схема сотового Service Manual LG B1300, 6,9 MБ, 04-02-2007 20:55, 634. Схема сотового.

1. Использование Multidownloader'а (gsmmulti) для перепрошивки · Восстановление анимации и звука на LG B1300 (B1200) · Инструкция по перепрошивке.
2. LG B1300 — это вторая бюджетная модель телефона от LG. понять смысл «Охотника» придется немного поковыряться в инструкции.
3. Service Manual LG 600, 3,22 MБ, 08-02-2007 10:59, 370. Схема сотового. Service Manual LG B1300, 6,9 MБ, 04-02-2007 20:55, 634. Схема сотового&nbsp.

The RF Chipset ……………………………………… 2- 2. The PA Circuit ………………………………………. Peripheral Circuit …………………………………… 2- 4. Digital Baseband Chip ……………………………… 2- 5. Table of Contents …………………… Chapter 5 – Test Point Data 5- 1. Component Side(1- 1) ……………………………….

Component Side(1- 2) ………………………………. Keypad Side(2- 1) …………………………………….

Chapter 6 – Assembly Instructions 1. Remove Battery Cover ………………………………… 2.

Remove Battery …………………………………………. Remove Screws ………………………………………… 4. Chapter 1. Performance 1- 1 Performance Item Description Specification EGSM9. Tx: 8. 90 + n*0. 2 MHz Rx: 9. MHz (n = 0 ～ 1. 24) Tx: 8.

MHz Frequency Band Rx: 9. MHz (n = 9. 75 ～ 1. GSM1. 80. 0 band Tx: 1. Rx: 1. 80. 5 + (n- 5. Item Description Specification GSM1. Control Level Power Level Tolerance 3.

Bm ±2d. B 2. 8 d. Bm ±3d. B 2. 6 d. Bm ±3d. B 2. 4 d.

Bm ±3d. B 2. 2 d. Bm ±3d. B 2. 0 d. Bm ±3d. B 1. 8 d. Bm ±3d. B Power Level 1. Bm ±3d. B 1. 4 d.

Bm ±3d. B 1. 2 d. Bm ±4d. B 1. 0 d. Bm ±4d. B.. Item Description Specification Max. GSM9. 00 Offset from Carrier (KHz). Spectrum due to switching transient GSM1.

Max. Offset from Carrier (KHz). Conduction, Emission Status, Appendix 1 Spurious emissions Conduction, Emission Status, Appendix 2 GSM9. BER(Class II) < 2. Bm Bit Error Rate DCS1. BER(Class II) < 2. Bm.. Item Description Specification Frequency(Hz) Max.(d.

B) Min.(d. B) 1,0. Receiving Response 3,0. Mean that Adopt a straight line in between 3. Hz& 1,0. 00. Hz to be Max. STMR 1. 3 +/- 5 d.

B Stability Margin > 6 d. B d. B to ARL (d. B) Level Ratio (d. B) 1. 7. 5.. Item Description Specification Under conditions, at least 1. Brand new and full 7. Ah battery 2. Full charge, keep GSM in idle mode 3.

Broadcast set off. Standby time 4. Signal strength=- 8. Bm, DRX=9multiframes 5. Back light of phone set off, no press keypad At least 9. B under below conditions: Ringer Volume 1.

Item Description Specification Linear Charger In put: 1. V or 2. 20 VAC, 5. Hz Out put: 5. VDC+/- 0.

V, 5. 00m. A (No Load) Travel Charger Switching- mode charger In put: 9. VAC, 5. 0/6. 0Hz Out put: 5. VDC+/- 0. 2. 5V, 5. A (No Load) - 9 - .. HW Feature Item Feature Comment Battery Li- Ion Battery, 7.

Ah GSM Imax(2. 80m. A),DCS Imax(2. 20m. A) AVG TCVR current (m. A) Stand by current (m. A) < =5m. A - Talk time 3- hour (GSM Tx Level_7) - Stand by time TBD- hour(Paging Period: 5 RSSI: -8. Bm) - Charging time 2- hour RX sensitivity GSM: -1.

Bm, DCS: -1. 05d. Bm GSM (Level 5: 3.

Bm).. Chapter 2. Technical Brief Circuit Description 2- 1 The RF Chipset The B1. RF integrates the TRF6. IC, TX/RX VCO, Power amplifier (RF3. Front End Module 8. T(switchplexer, RF- SAW filter), for dualband transmitting and receiving function. The Receiver The RF receive signal( EGSM 9. Mhz – 9. 60. MHz, DCS 1.

Mhz – 1. 88. 0Mhz) is input via the antenna or coaxial connector. An antenna matching circuit is between the antenna and the connector. An t EGS M - Rx EGS M b a n d EGS M - Tx EGS M.. The RF receive signal( EGSM 9. Mhz – 9. 60. MHz, DCS 1. Mhz – 1. 88. 0Mhz) is input via the antenna or coaxial connector. An antenna matching circuit is between the antenna and the connector.

Module(FEM8. 45. 0T) to switch either Rx or Tx path on. When the Rx path is turned on, the RF receive signal then feeds into two paths, EGSM Rx and DCS1. Rx. DCS Band From AUX VCO= 2 x IF Frequency CH 5.

CH 5. 32 8. 32 MHz CH 5. CH 5. 49 8. 37. 2 MHz CH 5. CH 5. 75 8. 32 MHz CH 5. CH 5. 97 8. 58 MHz CH 5. CH 6. 14 8. 37. 2 MHz CH 6. CH 6. 62 8. 58 MHz CH 6. The transmit signal is generated directly by a external TX/RX VCO (VON1.

C2. 8DKB). In the feedback path, the RF transmit signal is mixed with the off- chip main VCO to produce the desired TXIF (4. Mhz). This TXIF signal from the feedback path is then compared to the TXIF signal from the IF modulator at the detector.

Peripheral Circuit Temperature Sensor When the chip is not transmitting or receiving, its temperature can be measured by sensing the voltage on the external resistor from pin 3. From –4. 0 to +8.

C, the resistor voltage varies linearly from 0. V to 1. 3. 5V. Regulator and Serial Data Interface TRF6. RF componen ts. System Block Diagram of Hercrom. Analog Baseband Chip : Nausica_CS, TWL3. B The TWL3. 01. 2B device includes a complete set of baseband functions that perform the interface and processing of the following, voice signals, the baseband in- phase (I) and the quadrature (Q) signals, which support both the single- slot and multislot modes.

The TWL3. 01. 2B device also includes associated auxiliary RF control features, supply voltage regulation, battery charging controls, and switch on/off system analysis. System Block Diagram of Nausica_CS - 1. Peripheral 2- 6 CPU Memories Flash ROM An 3. Mbit programmable ROM which is capable of being written to while still in circuit. Contains all the main command software for the mobile. SRAM A 4. MBit SRAM memory is embedded in the HERCROM2.

ARM7 & DSP execution 2- 7 Power Supplies There are six regulators in the Nausica_CS . Power supply - 2.

Battery Charge Interface The charging device is a dc voltage source of 7 V absolute maximum. An external PMOS power transistor in series with a power Schottky diode connected between VCHG and VCC3 of the TWL3. B device controls the current flow from the charging device to the main battery. Battery Charge Control Circuit - 2. System Connector This Connecter is for travel/desk charger, accessories connection and data access (trace, debug and Software Download). System Connector Specification Pin name Pin Description DSR / USC0 DSR ( GPIO3.

DAI CLK /TCK) USC1 GSPa_ RX / DAIRX / TDI USC2 GSPa_TX / DAI TX /TDO USC4 / USC3.. Please forget about pin 1. External Battery Contact Pin) - 2. Keypad Switches and Scanning The key switches are metal domes which make contact between two concentric pads on the top layer of the PCB when pressed.

There are 1. 8 switches (S3. Figure, except for the power switch(S3. Display Interface Power to the LCD is supplied by VR2.

B of Nausica_CS. The LCD can be reseted by RES. A low on this output reset the LCD. There is also the control output CS which is also derived from Hercrom. LCD module. Hercrom. D0- D7 to send serial data for displaying graphical text onto the LCD.

Microphone A microphone holder is mounted on PCB and is used to hold the microphone between frond cover and PCB. The audio signal is passed to the MICIN of Nausica_CS. The voltage supply MICBIAS is coming from Nausica_CS., and is a bias voltage for both the MICIP and AUDIO_ IN lines form system connector. Headset Interface The audio input of the headset is connected to AUXIN pin of Nausica_CS, the microphone is biased by MICBIAS pin form Nausica_CS, too. The audio out to the headset kit is fed with EARN pin of Nausica_CS, 2- 1.

Back- light Illumination In Back- Light illumination, there are 1. Blue LEDs (six for keys and four for the LCD), which are driven by BACKLIGH line from Hercrom.

Chapter 3. Failure List FAILURE ITEM NO RING TONE RING TONE DISTORTION NO KEY TONE AUDIO NOISE POOR VOICE QUALITY LOW VOICE VOLUME RECEIVER / EARPIECE MUTE POOR HANDFREE VOICE QUILITY TOTALLY DEAD/NO POWER UNEXPECTED POWER ON UNEXPECTED POWER OFF/POWER OFF BY PLUG IN A EARPIECE RANDOM TIME DISPLAY CLOCK RESET AT POMER ON /CLOCK DEAD NO SERVE FOUND/NO NET WORK REGISTER.. FAILURE ITEM BAD CHARGER CONNECTOR CAN'T POWER ON AFTER CHARGING SHORT WAITING HOURS HIGH POWER CONSUMATION BATTERY DAMAGE BATTERY CAN'T BE CHARGED BATTERY LEVEL DON'T DISPLAY BATTERY LEVEL DISPLAY NOT CORRECT INCOMPATIBLE WITH BATTERY SIM CARD UNRECOGNIZE BAD SIM CARD CONTACT UNEXPECTED SIM CARD LOCK HOUSING DAMAGE BAD KEYPAD RESPONSE.. Chapter 4. Trouble Shooting 4- 1 Power Supply Failure a) Failure : - Problem with turning on mobile phone Solution: - Test the set’s current by using battery simulator: observe the value of current used - Case 1: C2.

C2. 27 If the Current is higher than 3. A, please check C2. C2. 27, if short circuit, Replace it - Case 2.. Failure : - The value of the charging current look like short circuit. Solution : - Re- install the software - Check Q1. Q1. 01 4- 2 Software Download Failure a) Failure : - Problem with software download Solution : - J1.

Voice Function Failure a) Failure : - Microphone voice failure Solution : - Test the bias voltage on R3. R3. 01 be 2. 5. V, - Replace Microphone, if bias voltage is fine. J1. 04 b) Failure : - Speaker failure Solution : - Check speaker connector, it may be bad connection.

Display Function Failure a) Failure : - No display on LCD Solution : - Test the resistance of C3. C3. 27 by using multi- meter, the value should be infinity. Replace the capacitor, which has any impedance. Test the resistance of R3.

R3. 13, if cold soldering, Please re- solder again. Failure : - No Back- light Solution : - Replace the LED that doesn’t light up including any failing parts of LED. If all of the LED fails, Please check Q3. Q3. 02 and related circuits. Q3. 02 Q3. 01 - 3. Chapter 5. Test Point Data 5- 1 Component Side (1- 1) - 3.

Loca- Component Side (1- 1) tion J1. Battery connector : For damage or cold soldering cause power on failure U2. Nausica_CS : analog baseband chipset (ABB) U2. Hercrom. 20 : digital baseband chipset (DBB) U3. Mbit flash ROM : For damage or cold soldering cause power on failure P- channel MOSFET with schottky diode : For damage or cold soldering Q1. Cause charger function failure..- 4.

Component Side (1- 2) 2. Loca- Component Side (1- 2) tion VR2. B regulator (2. 8. V) : For damage or cold soldering cause power C2. DBB & ABB peripheral failure. VR1. B regulator (2.

V) : For damage or cold soldering cause power C2. ABB internal logic failure VR3 regulator (2.

V) : For damage or cold soldering cause power C2. ABB analog circuits failure..- 4. Keypad Side (2- 1) - 4. Loca- Keypad Side (2- 1) tion LCM Connector : For damage or cold soldering cause LCD Display DS3.